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BMI-C-007-01
RFI FINGERSTOCK BECU TIN SOLDER
Property Bar
Number
SC-BMI-C--6J58TI
manufacturer:
Laird Technologies EMI
MPN#
SC-BMI-C--6J58TI
RoHS Compliance:
Full
Sample:
Get Free Sample
specifications
    Part Status
    Active
    No Load Power Consumption
    -
    Termination Style
    Solder
    Contact Material
    Beryllium Copper
    Contact Finish
    Tin
    Height - Seated (Max)
    0.059" (1.50mm)
    Height - Seated (Max)
    0.130" (3.30mm)
    Shelf Life
    24 Months
    Thickness (Max)
    0.126" (3.20mm)
    Shelf Life Start
    Date of Shipment
    Type
    Fingerstock
    Structure
    50°F ~ 77°F (10°C ~ 25°C)
Substitute Parts
    BMI-C-001
    Laird Technologies EMI
    RFI FINGERSTOCK BECU GOLD SOLDER
    quantity 1
    price USD $1.14
    BMI-C-002
    Laird Technologies EMI
    RFI FINGERSTOCK BECU GOLD SOLDER
    quantity 1
    price USD $1.84
    BMI-C-004
    Laird Technologies EMI
    RFI FINGERSTOCK BECU GOLD SOLDER
    quantity 1
    price USD $1.60
    BMI-C-006
    Laird Technologies EMI
    RFI FINGERSTOCK BECU TIN SOLDER
    quantity 1
    price USD $0.80
    4046PA51H01800
    Laird Technologies EMI
    RFI FOF GASKET PU ADH
    quantity 1
    price USD $5.75
inventory 16752
minimum
1
package
Cut Tape (CT) & Digi-Reel®
delivery time
Shipment within 48 hours
price
quantity
unit price
price
1
0.74
0.74
10
0.53
5.3
25
0.48
12
100
0.42
42
250
0.39
97.5
500
0.37
185
1000
0.36
360
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