Loading...

BMI-C-006
RFI FINGERSTOCK BECU TIN SOLDER
Property Bar
Number
SC-BMI-C--EDMH95
manufacturer:
Laird Technologies EMI
MPN#
SC-BMI-C--EDMH95
RoHS Compliance:
Full
Sample:
Get Free Sample
specifications
    Part Status
    Active
    No Load Power Consumption
    -
    Lead Spacing
    0.100" (2.54mm)
    Termination Style
    Solder
    Thickness (Max)
    0.079" (2.00mm)
    Contact Material
    Beryllium Copper
    Contact Finish
    Tin
    Shelf Life
    12 Months
    Type
    Fingerstock
    Structure
    50°F ~ 77°F (10°C ~ 25°C)
    Width - Outer Edges
    0.113" (2.86mm)
Substitute Parts
    BMI-C-001
    Laird Technologies EMI
    RFI FINGERSTOCK BECU GOLD SOLDER
    quantity 1
    price USD $1.14
    BMI-C-002
    Laird Technologies EMI
    RFI FINGERSTOCK BECU GOLD SOLDER
    quantity 1
    price USD $1.84
    BMI-C-004
    Laird Technologies EMI
    RFI FINGERSTOCK BECU GOLD SOLDER
    quantity 1
    price USD $1.60
    BMI-C-007-01
    Laird Technologies EMI
    RFI FINGERSTOCK BECU TIN SOLDER
    quantity 1
    price USD $0.74
    4046PA51H01800
    Laird Technologies EMI
    RFI FOF GASKET PU ADH
    quantity 1
    price USD $5.75
inventory 15745
minimum
1
package
Cut Tape (CT) & Digi-Reel®
delivery time
Shipment within 48 hours
price
quantity
unit price
price
1
0.8
0.8
10
0.57
5.7
25
0.51
12.75
100
0.45
45
250
0.42
105
500
0.4
200
1000
0.39
390
Please send an inquiry form, we will reply immediately
Contact Name
email
corporate name
country
quantity
content
Delivery & Payment

(0 Items)

it was empty.