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BMI-C-002
RFI FINGERSTOCK BECU GOLD SOLDER
Property Bar
Number
SC-BMI-C--0RJB9H
MPN#
SC-BMI-C--0RJB9H
RoHS Compliance:
Full
Sample:
Get Free Sample
specifications
    Part Status
    Active
    No Load Power Consumption
    -
    Contact Finish
    Gold
    Lead Spacing
    0.100" (2.54mm)
    Termination Style
    Solder
    Height - Seated (Max)
    0.394" (10.00mm)
    Contact Material
    Beryllium Copper
    Shelf Life
    12 Months
    Type
    Fingerstock
    Structure
    50°F ~ 77°F (10°C ~ 25°C)
    Composition
    0.085" (2.17mm)
Substitute Parts
    Laird Technologies EMI
    RFI FINGERSTOCK BECU GOLD SOLDER
    quantity 1
    price USD $1.14
    Laird Technologies EMI
    RFI FINGERSTOCK BECU GOLD SOLDER
    quantity 1
    price USD $1.60
    Laird Technologies EMI
    RFI FINGERSTOCK BECU TIN SOLDER
    quantity 1
    price USD $0.80
    Laird Technologies EMI
    RFI FINGERSTOCK BECU TIN SOLDER
    quantity 1
    price USD $0.74
    Laird Technologies EMI
    RFI FOF GASKET PU ADH
    quantity 1
    price USD $5.75
inventory 7877
minimum
1
package
Cut Tape (CT) & Digi-Reel®
delivery time
Shipment within 48 hours
price
quantity
unit price
price
1
1.84
1.84
10
1.36
13.6
25
1.23
30.75
100
1.1
110
250
1.04
260
500
1
500
1000
0.96
960
2500
0.94
2350
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