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PA-TS1D6SM18-56
ADAPTER 56TSOP TO 56DIP
PDF
Property Bar
Number
SC-PA-TS1-D9NYFC
manufacturer:
Logical Systems Inc.
MPN#
SC-PA-TS1-D9NYFC
RoHS Compliance:
Full
Sample:
Get Free Sample
specifications
    Part Status
    Active
    No Load Power Consumption
    -
    Package / Case
    Through Hole
    Height - Seated (Max)
    0.020" (0.50mm)
    Lead Spacing
    0.100" (2.54mm)
    Termination Style
    Solder
    Thickness (Max)
    0.125" (3.18mm)
    Number of Positions Loaded
    56
    Supplier Device Package
    DIP
    Height Above Board
    TSOP
Document
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inventory 1600
minimum
1
package
Bulk
delivery time
Shipment within 48 hours
price
quantity
unit price
price
1
28
28
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